Magnetic field imaging and light induced capacitance alteration for failure analysis of Cu-TSV interconnects

De Wolf, IngridIngridDe WolfJacobs, Kristof J.P.Kristof J.P.JacobsOrozco, AntonioAntonioOrozco2021-10-282021-10-2820200026-2714https://imec-publications.be/handle/20.500.12860/35010Magnetic field imaging and light induced capacitance alteration for failure analysis of Cu-TSV interconnectsJournal articlehttps://doi.org/10.1016/j.microrel.2020.113780