Cu Pad Surface Height Evaluation Technique by In-line SEM for Wafer Hybrid Bonding

Kasai, HiroakiHiroakiKasaiOsaki, MayukaMayukaOsakiHasumi, KazuhisaKazuhisaHasumiMise, NobuyukiNobuyukiMiseTanaka, MakiMakiTanakaTunca Altintas, BensuBensuTunca AltintasChew, Soon AikSoon AikChewBogdanowicz, JanuszJanuszBogdanowiczMoussa, AlainAlainMoussaSaib, MohamedMohamedSaibZhang, BoyaoBoyaoZhangCharley, Anne-LaureAnne-LaureCharley2024-08-262024-06-152024-08-262024978-1-5106-7216-10277-786XWOS:001224296200044https://imec-publications.be/handle/20.500.12860/44046Cu Pad Surface Height Evaluation Technique by In-line SEM for Wafer Hybrid BondingProceedings paper10.1117/12.3008658978-1-5106-7217-8WOS:001224296200044