Electromigration behavior of Cu/SiCN to Cu/SiCN hybrid bonds for 3D integrated circuits

De Messemaeker, JokeJokeDe MessemaekerKim, Soon-WookSoon-WookKimStucchi, MicheleMicheleStucchiBeyer, GeraldGeraldBeyerBeyne, EricEricBeyneCroes, KristofKristofCroes2021-10-252021-10-252018https://imec-publications.be/handle/20.500.12860/30538Electromigration behavior of Cu/SiCN to Cu/SiCN hybrid bonds for 3D integrated circuitsProceedings paper