Texture characterization of Cu interconnects with different Ta-based sidewall diffusion barriers

Wilson, ChrisChrisWilsonZhao, ChaoChaoZhaoVolders, HennyHennyVoldersZhao, LarryLarryZhaoCroes, KristofKristofCroesTokei, ZsoltZsoltTokeiBeyer, GeraldGeraldBeyer2021-10-192021-10-1920110167-9317https://imec-publications.be/handle/20.500.12860/20150Texture characterization of Cu interconnects with different Ta-based sidewall diffusion barriersJournal articlehttp://dx.doi.org/10.1016/j.mee.2010.06.014