The effect of deposition and annealing conditions on the stress in metallization materials for VLSI interconnects

Witvrouw, AnnAnnWitvrouwMaex, KarenKarenMaex2021-09-292021-09-291994https://imec-publications.be/handle/20.500.12860/462The effect of deposition and annealing conditions on the stress in metallization materials for VLSI interconnectsProceedings paper