Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

Okoro, ChukwudiChukwudiOkoroLabie, RietRietLabieVanstreels, KrisKrisVanstreelsFranquet, AlexisAlexisFranquetGonzalez, MarioMarioGonzalezVandevelde, BartBartVandeveldeBeyne, EricEricBeyneVandepitte, DirkDirkVandepitteVerlinden, BertBertVerlinden2021-10-192021-10-1920110022-2461https://imec-publications.be/handle/20.500.12860/19506Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of CuJournal article