The bottom-up copper fill of Ø5μm × 40μm vias using 2-component model chemistry

Radisic, AlexAlexRadisicYang, LiuLiuYangDrijbooms, ChrisChrisDrijboomsBender, HugoHugoBender2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/19644The bottom-up copper fill of Ø5μm × 40μm vias using 2-component model chemistryMeeting abstracthttp://ecsmeet2.peerx-press.org/ms_files/ecsmeet2/2011/04/27/00001213/00/1213_0_art_0_lkbj8r.pdf