Vakanas, GeorgeGeorgeVakanasVandecasteele, BjornBjornVandecasteeleDe Preter, IngeIngeDe PreterDerakhshandeh, JaberJaberDerakhshandehSnyder, BradBradSnyderVan Campenhout, JorisJorisVan CampenhoutCroes, KristofKristofCroesRebibis, Kenneth JuneKenneth JuneRebibisBeyne, EricEricBeyne2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/24655Bismuth-based solder characterization for lower-temperature assembly of thermally-sensitive components in 3D interconnect applicationsMeeting abstract