Real time investigation of conduction mechanism with bias stress in silica-based intermetal dielectrics

Li, YunlongYunlongLiGroeseneken, GuidoGuidoGroesenekenMaex, KarenKarenMaexTokei, ZsoltZsoltTokei2021-10-162021-10-162007https://imec-publications.be/handle/20.500.12860/12479Real time investigation of conduction mechanism with bias stress in silica-based intermetal dielectricsJournal article