Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs

Agnesina, AnthonyAnthonyAgnesinaBrunion, MoritzMoritzBrunionKim, JinwooJinwooKimGarcia-Ortiz, AlbertoAlbertoGarcia-OrtizMilojevic, DragomirDragomirMilojevicCatthoor, FranckyFranckyCatthoorMirabelli, GioeleGioeleMirabelliKomalan, ManuManuKomalanLim, Sung KyuSung KyuLim2023-08-032023-06-242023-06-262023-08-0320232156-3950WOS:000982913300002https://imec-publications.be/handle/20.500.12860/42084Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICsJournal article10.1109/TCPMT.2023.3264520WOS:000982913300002CIRCUITSFace-to-Face-Bonded 3-D ICsPower, Performance, Area, and Cost Analysis