Thermomechanical models for leadless solder interconnections in flip chip assemblies

Vandevelde, BartBartVandeveldeChristiaens, FilipFilipChristiaensBeyne, EricEricBeyneRoggen, JeanJeanRoggenPeeters, J.J.PeetersAllaert, K.K.AllaertVandepitte, D.D.VandepitteBergmans, J.J.Bergmans2021-10-012021-10-011998https://imec-publications.be/handle/20.500.12860/3096Thermomechanical models for leadless solder interconnections in flip chip assembliesJournal article