Cu TSV stress: avoiding Cu protrusion and impact on devices

Beyne, EricEricBeyneDe Messemaeker, JokeJokeDe MessemaekerGuo, WeiWeiGuo2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/23547Cu TSV stress: avoiding Cu protrusion and impact on devicesBook chapterhttp://onlinelibrary.wiley.com/doi/10.1002/9783527670109.ch27/summary