Raman spectroscopy study of stress in 3D-stacked chips and correlation with FEM and electrical measurements

De Wolf, IngridIngridDe WolfSimons, VeerleVeerleSimonsLofrano, MelinaMelinaLofranoCherman, VladimirVladimirChermanDe Vos, JoeriJoeriDe VosVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyne2021-10-222021-10-222014-09https://imec-publications.be/handle/20.500.12860/23736Raman spectroscopy study of stress in 3D-stacked chips and correlation with FEM and electrical measurementsProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6962729