Physics based modeling of bimodal electromigration failure distributions and variation analysis for VLSI interconnects

Nair, Sarath MohanachandranSarath MohanachandranNairBishnoi, RajendraRajendraBishnoiTahoori, Mehdi B.Mehdi B.TahooriZahedmanesh, HoumanHoumanZahedmaneshCroes, KristofKristofCroesGarello, KevinKevinGarelloKar, Gouri SankarGouri SankarKarCatthoor, FranckyFranckyCatthoor2022-01-202021-11-022022-01-2020201541-7026WOS:000612717200016https://imec-publications.be/handle/20.500.12860/38200Physics based modeling of bimodal electromigration failure distributions and variation analysis for VLSI interconnectsProceedings paper978-1-7281-3199-3WOS:000612717200016