Investigation of Co thin film as buffer layer applied to Cu/Sn eutectic bonding and UBM with Sn, SnCu, and SAC solders joints

Tang, Ya-ShengYa-ShengTangDerakhshandeh, JaberJaberDerakhshandehKho, Yi-TungYi-TungKhoChang, Yao-JenYao-JenChangSlabbekoorn, JohnJohnSlabbekoornDe Preter, IngeIngeDe PreterVanstreels, KrisKrisVanstreelsRebibis, Kenneth JuneKenneth JuneRebibisBeyne, EricEricBeyneChen, Kuan-NengKuan-NengChen2021-10-242021-10-2420172156-3950https://imec-publications.be/handle/20.500.12860/29552Investigation of Co thin film as buffer layer applied to Cu/Sn eutectic bonding and UBM with Sn, SnCu, and SAC solders jointsJournal articlehttp://ieeexplore.ieee.org/document/8024028/