Scaling the 3D bumps pitch from 20 to 10 μm, focusing on the wet Cu seed etch process development

Suhard, SamuelSamuelSuhardMoussa, AlainAlainMoussaSlabbekoorn, JohnJohnSlabbekoornBeirnaert, FilipFilipBeirnaertDe Preter, IngeIngeDe PreterHolsteyns, FrankFrankHolsteyns2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/24573Scaling the 3D bumps pitch from 20 to 10 μm, focusing on the wet Cu seed etch process developmentProceedings paperhttp://www.scientific.net/SSP.219.237