Thermo-mechanical analysis of a chip scale package (CSP) using lead free and lead containing solder materials

Gonzalez, MarioMarioGonzalezVandevelde, BartBartVandeveldeBeyne, EricEricBeyne2021-10-152021-10-152004-06https://imec-publications.be/handle/20.500.12860/8969Thermo-mechanical analysis of a chip scale package (CSP) using lead free and lead containing solder materialsProceedings paper