Novel failure analysis techniques for 1.8 μm pitch wafer-to-wafer bonding

Schmidt, ChristianChristianSchmidtLechner, LorenzLorenzLechnerDe Wolf, IngridIngridDe WolfKim, Soon-WookSoon-WookKimBeyne, EricEricBeyne2021-10-262021-10-262018https://imec-publications.be/handle/20.500.12860/31738Novel failure analysis techniques for 1.8 μm pitch wafer-to-wafer bondingProceedings paperhttps://ieeexplore.ieee.org/abstract/document/8429535