Cu/Low-k thickness measurement for advanced Cu CMP process development and control

Li, YunlongYunlongLiHeylen, NancyNancyHeylenDelande, TinneTinneDelandeKellens, KristofKristofKellensOng, PatrickPatrickOngLeunissen, PeterPeterLeunissenTarnowka, AlexandreAlexandreTarnowkaEliyahu, AvivAvivEliyahu2021-10-182021-10-182009-03https://imec-publications.be/handle/20.500.12860/15711Cu/Low-k thickness measurement for advanced Cu CMP process development and controlProceedings paperhttp://www.ecsdl.org/getpdf/servlet/GetPDFServlet?filetype=pdf&id=ECSTF8000018000001000453000001&idtype=cvips&prog=normal