Developing underfill process in screening of no-flow underfill and wafer-applied underfill materials for 3D stacking

Rebibis, Kenneth JuneKenneth JuneRebibisCapuz, GiovanniGiovanniCapuzDaily, RobertRobertDailyGerets, CarineCarineGeretsDuval, FabriceFabriceDuvalWang, TengTengWangStruyf, HerbertHerbertStruyfMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyneSwinnen, BartBartSwinnen2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/22987Developing underfill process in screening of no-flow underfill and wafer-applied underfill materials for 3D stackingProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6745697