Wet Cu passivation for high throughput fluxless Thermal Compression Bonding of Cu-Sn μbumps for Die-to-Wafer stacking

Rip, JensJensRipDerakhshandeh, JaberJaberDerakhshandehNegishi, RyoRyoNegishiTomatsu, ItsuroItsuroTomatsuCuypers, Dieter H.Dieter H.CuypersBeyne, EricEricBeyne2025-02-122024-12-072025-02-122024979-8-3503-7599-20569-5503WOS:001260983500305https://imec-publications.be/handle/20.500.12860/44953Wet Cu passivation for high throughput fluxless Thermal Compression Bonding of Cu-Sn μbumps for Die-to-Wafer stackingProceedings paper10.1109/ECTC51529.2024.00311979-8-3503-7598-5WOS:001260983500305