Highly-conformal plasma-enhanced atomic-layer deposition silicon dioxide liner for high aspect-ratio through-silicon via 3D interconnections

Civale, YannYannCivaleRedolfi, AugustoAugustoRedolfiVelenis, DimitriosDimitriosVelenisHeylen, NancyNancyHeylenBeynet, JulienJulienBeynetJung, InsooInsooJungWoo, Jeong-JunJeong-JunWooSwinnen, BartBartSwinnenBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/20469Highly-conformal plasma-enhanced atomic-layer deposition silicon dioxide liner for high aspect-ratio through-silicon via 3D interconnectionsProceedings paper