Simicic, MarkoMarkoSimicicGijbels, FrankFrankGijbelsIacovo, SerenaSerenaIacovoChen, Shih-HungShih-HungChenVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyne2024-03-212023-11-302024-03-2120230739-5159WOS:001094864400014https://imec-publications.be/handle/20.500.12860/43204Heterogeneous bonding technologies are an attractive way to assemble high performance computing systems today. However, ESD risks of 2.5D/3D bonding are not fully understood. To help ESD control engineers and tool manufacturers, this paper describes the 2.5D/3D bonding processes and gives practical insights into the relevant ESD process assessment steps.Proceedings paper978-1-58537-347-5WOS:001094864400014