Simicic, MarkoMarkoSimicicGijbels, FrankFrankGijbelsIacovo, SerenaSerenaIacovoChen, Shih-HungShih-HungChenVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyne2024-03-212023-11-302024-03-2120230739-5159WOS:001094864400014https://imec-publications.be/handle/20.500.12860/43204ESD process assessment of 2.5D and 3D bonding technologiesProceedings paper978-1-58537-347-5WOS:001094864400014