Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect

Zhang, WenqiWenqiZhangBrongersma, SywertSywertBrongersmaVan Aelst, JokeJokeVan AelstRichard, OlivierOlivierRichardBamal, MandeepMandeepBamalHeylen, NancyNancyHeylenLi, YunlongYunlongLiBeyer, GeraldGeraldBeyerMaex, KarenKarenMaex2021-10-162021-10-162005https://imec-publications.be/handle/20.500.12860/11603Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effectOral presentation