Ivankovic, AndrejAndrejIvankovicCherman, VladimirVladimirChermanGonzalez, MarioMarioGonzalezVandevelde, BartBartVandeveldeVandepitte, DirkDirkVandepitteBeyer, GeraldGeraldBeyerBeyne, EricEricBeyneDe Wolf, IngridIngridDe Wolf2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/23992The underfill-microbump interaction mechanism in 3D ICs: impact and mitigation of induced stressesProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6813831&contentType=Conference+Publications