Cryoetching of silicon and advanced materials for 3D interconnects

Dussart, R.R.DussartTillocher, T.T.TillocherGosset, NNGossetLefaucheux, P.P.LefaucheuxL'jazouli, RRL'jazouliBoufnichel, M.M.BoufnichelZhang, LipingLipingZhangde Marneffe, Jean-FrancoisJean-Francoisde MarneffeBaklanov, MikhaïlMikhaïlBaklanovNishimura, EENishimuraYatsuda, KKYatsudaMaekawa, KKMaekawa2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/23784Cryoetching of silicon and advanced materials for 3D interconnectsMeeting abstracthttp://ma.ecsdl.org/content/MA2014-02/33/1689.abstract