Jourdain, AnneAnneJourdainSoussan, PhilippePhilippeSoussanSwinnen, BartBartSwinnenBeyne, EricEricBeyne2021-10-172021-10-172009https://imec-publications.be/handle/20.500.12860/15551Electrically yielding collective hybrid bonding for 3D stacking of ICsProceedings paper