Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder joints

Vandevelde, BartBartVandeveldeLabie, RietRietLabieLauwaert, RalphRalphLauwaertDudek, RainerRainerDudekGromala, PrzemyslawPrzemyslawGromalaEichorst, MichaelMichaelEichorst2023-11-232023-10-152023-11-2320232833-8553WOS:001058887300096https://imec-publications.be/handle/20.500.12860/42756Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder jointsProceedings paper10.1109/EuroSimE56861.2023.10100841979-8-3503-4597-1WOS:001058887300096