Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer

Kaur, KamalpreetKamalpreetKaurMissinne, JeroenJeroenMissinneVan Steenberge, GeertGeertVan Steenberge2021-10-222021-10-2220140003-6951https://imec-publications.be/handle/20.500.12860/24037Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transferJournal articlehttp://scitation.aip.org/content/aip/journal/apl/104/6/10.1063/1.4864406