Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures

Yang, YuYuYangLabie, RietRietLabieLing, FangzhouFangzhouLingZhao, ChaoChaoZhaoRadisic, AlexAlexRadisicVan Olmen, JanJanVan OlmenTravaly, YoussefYoussefTravalyVerlinden, BertBertVerlindenDe Wolf, IngridIngridDe Wolf2021-10-192021-10-1920100026-2714https://imec-publications.be/handle/20.500.12860/18381Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architecturesJournal articlehttp://dx.doi.org/10.1016/j.microrel.2010.07.019