Effect of bake/cure temperature of an advanced organic ultra low-k material on the interface adhesion strength to metal barriers

Vanstreels, KrisKrisVanstreelsPantouvaki, MariannaMariannaPantouvakiFerchichi, AbdelkarimAbdelkarimFerchichiVerdonck, PatrickPatrickVerdonckConard, ThierryThierryConardOno, YukiharuYukiharuOnoMatsutani, MihokoMihokoMatsutaniNakatani, KojiKojiNakataniBaklanov, MikhaïlMikhaïlBaklanov2021-10-192021-10-1920110021-8979https://imec-publications.be/handle/20.500.12860/20040Effect of bake/cure temperature of an advanced organic ultra low-k material on the interface adhesion strength to metal barriersJournal article