Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test-Part I

Hao, QinfenQinfenHaoChen, Kuan-NengKuan-NengChenGoel, Sandeep KumarSandeep KumarGoelLi, HaiHaiLiMarinissen, Erik JanErik JanMarinissen2026-04-272026-04-2720252156-3357https://imec-publications.be/handle/20.500.12860/59199engGuest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test-Part IEditorial material10.1109/JETCAS.2025.3600772WOS:001576681500008