Reduced 2nd level solder joint life time of low-CTE mold compound packages

Vandevelde, BartBartVandeveldeLabie, RietRietLabieDegrendele, LievenLievenDegrendeleCauwe, MaartenMaartenCauweDe Baets, JohanJohanDe BaetsWillems, GeertGeertWillems2021-10-222021-10-222014-05https://imec-publications.be/handle/20.500.12860/24730Reduced 2nd level solder joint life time of low-CTE mold compound packagesProceedings paperhttps://escies.org/webdocument/showArticle?id=992&groupid=6