Cupak, MiroslavMiroslavCupakOprins, HermanHermanOprinsVan der Plas, GeertGeertVan der PlasMarchal, PolPolMarchalVandevelde, BartBartVandeveldeSrinivasan, AdiAdiSrinivasanCheng, EdmundEdmundCheng2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/16925A practical approach to thermal modeling and validation of 3D-ICsMeeting abstract