Rampelberg, GeertGeertRampelbergDevloo-Casier, KilianKilianDevloo-CasierDeduytsche, DavyDavyDeduytscheSchaekers, MarcMarcSchaekersBlasco, NicolasNicolasBlascoDetavernier, ChristopheChristopheDetavernier2021-10-212021-10-2120130003-6951https://imec-publications.be/handle/20.500.12860/22982Low temperature plasma-enhanced atomic layer deposition of thin vanadium nitride layers for copper diffusion barriersJournal article