Chandrasekhar, ArunArunChandrasekharBeyne, EricEricBeyneDe Raedt, WalterWalterDe RaedtNauwelaers, BartBartNauwelaers2021-10-142021-10-142001https://imec-publications.be/handle/20.500.12860/5131Characterisation of IC packages for RF applicationsProceedings paper