Development of very thin (<30μm) germanium substrates enabling high-voltage integrated multi-junction modules

Flamand, GiovanniGiovanniFlamandGeens, WimWimGeensvan der Heide, JohanJohanvan der HeideSimons, EddyEddySimonsTaylor, StephenStephenTaylor2021-10-162021-10-162005https://imec-publications.be/handle/20.500.12860/10453Development of very thin (<30μm) germanium substrates enabling high-voltage integrated multi-junction modulesProceedings paper