Improvement in post-Chemical Mechanical Planarization cleaning process for Ru interconnects

Harada, KenKenHaradaShibata, ToshiakiToshiakiShibataKawase, YasuhiroYasuhiroKawaseTeugels, LieveLieveTeugelsHeylen, NancyNancyHeylenStruyf, HerbertHerbertStruyf2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/33099Improvement in post-Chemical Mechanical Planarization cleaning process for Ru interconnectsOral presentationhttps://www.linx-consulting.com/wp-content/uploads/2019/04/SPCC-2019-Proceedings-Binder.pdf