Characterization and benchmarking of the low inter-tier thermal resistance of 3D hybrid Cu/dielectric wafer-to-wafer bonding

Oprins, HermanHermanOprinsCherman, VladimirVladimirChermanWebers, TomasTomasWebersSalahouelhadj, AbdellahAbdellahSalahouelhadjKim, Soon-WookSoon-WookKimPeng, LanLanPengVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyne2021-10-242021-10-242017-031043-7398https://imec-publications.be/handle/20.500.12860/29118Characterization and benchmarking of the low inter-tier thermal resistance of 3D hybrid Cu/dielectric wafer-to-wafer bondingJournal article10.1115/1.4035597http://electronicpackaging.asmedigitalcollection.asme.org/article.aspx?articleID=2596186