Integration of electroless and electrolytic Cu and IC back end of line technologies

Maex, KarenKarenMaexBrongersma, SywertSywertBrongersmaLantasov, YuriYuriLantasovRichard, EmmanuelEmmanuelRichardPalmans, RogerRogerPalmansVervoort, IwanIwanVervoort2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4551Integration of electroless and electrolytic Cu and IC back end of line technologiesProceedings paper