Radisic, AlexAlexRadisicNagar, MagiMagiNagarStrubbe, KatrienKatrienStrubbeArmini, SilviaSilviaArminiEl-Mekki, ZaidZaidEl-MekkiVolders, HennyHennyVoldersRuythooren, WouterWouterRuythoorenVereecken, PhilippePhilippeVereecken2021-10-182021-10-182009https://imec-publications.be/handle/20.500.12860/16071Copper plating on resistive substrates, diffusion barrier and alternative seed layersMeeting abstract