De Munck, KoenKoenDe MunckChiarella, ThomasThomasChiarellaDe Moor, PietPietDe MoorSwinnen, BartBartSwinnenVan Hoof, ChrisChrisVan Hoof2021-10-172021-10-1720080741-3106https://imec-publications.be/handle/20.500.12860/13615Influence of extreme thinning on 130nm CMOS devices for 3D integrationJournal article