Multi-tier die stacking through collective die-to-wafer hybrid bonding.

Kennes, KoenKoenKennesLin, YeYeLinSuhard, SamuelSamuelSuhardBex, PieterPieterBexCuypers, Dieter H.Dieter H.CuypersGuerrero, AliceAliceGuerreroBumueller, DennisDennisBumuellerPhommahaxay, AlainAlainPhommahaxayBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2025-04-102024-12-072025-04-102024979-8-3503-7599-20569-5503WOS:001260983500102https://imec-publications.be/handle/20.500.12860/44943Multi-tier die stacking through collective die-to-wafer hybrid bonding.Proceedings paper10.1109/ECTC51529.2024.00106979-8-3503-7598-5WOS:001260983500102