Thermal and thermo-mechanical evaluation of a 'chip in moulded interconnect device'

Christiaens, FilipFilipChristiaensBeyne, EricEricBeyneRoggen, JeanJeanRoggenVan Puymbroeck, JanJanVan PuymbroeckHeerman, M.M.Heerman2021-09-302021-09-301997https://imec-publications.be/handle/20.500.12860/1766Thermal and thermo-mechanical evaluation of a 'chip in moulded interconnect device'Proceedings paper