Demonstration of a collective hybrid die-to-wafer integration using glass carrier

Suhard, SamuelSamuelSuhardKennes, KoenKoenKennesBex, PieterPieterBexJourdain, AnneAnneJourdainTeugels, LieveLieveTeugelsWalsby, EdwardEdwardWalsbyBolton, ChrisChrisBoltonPatel, JashJashPatelAshraf, HumaHumaAshrafBarnett, RichardRichardBarnettFodor, FerencFerencFodorPhommahaxay, AlainAlainPhommahaxayLa Tulipe, Douglas CharlesDouglas CharlesLa TulipeBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2023-08-102023-06-202023-08-1020210569-5503WOS:000702282700313https://imec-publications.be/handle/20.500.12860/41967Demonstration of a collective hybrid die-to-wafer integration using glass carrierProceedings paper10.1109/ECTC32696.2021.00325978-0-7381-4523-5WOS:000702282700313