Reduction of plasma induced damage of porous low-k materials using a cryogenic etching process

Tillocher, T.T.TillocherLeroy, F.F.LeroyZhang, LipingLipingZhangLefaucheux, P.P.LefaucheuxYatsuda, K.K.YatsudaMaekawa, K.K.Maekawade Marneffe, Jean-FrancoisJean-Francoisde MarneffeBaklanov, MikhaïlMikhaïlBaklanovDussart, R.R.Dussart2021-10-222021-10-222015https://imec-publications.be/handle/20.500.12860/25995Reduction of plasma induced damage of porous low-k materials using a cryogenic etching processProceedings paper