Three-dimensional micro-Raman spectroscopy mapping of stress induced in Si by Cu-filled through-Si vias

Kosemura, DaisukeDaisukeKosemuraDe Wolf, IngridIngridDe Wolf2021-10-222021-10-2220150003-6951https://imec-publications.be/handle/20.500.12860/25487Three-dimensional micro-Raman spectroscopy mapping of stress induced in Si by Cu-filled through-Si viasJournal articlehttp://scitation.aip.org/content/aip/journal/apl/106/19/10.1063/1.4921004