Foundations for successful RF chip-package co-design: a packaging perspective

Chandrasekhar, ArunArunChandrasekharBeyne, EricEricBeyneDe Raedt, WalterWalterDe RaedtNauwelaers, BartBartNauwelaers2021-10-142021-10-142002https://imec-publications.be/handle/20.500.12860/6096Foundations for successful RF chip-package co-design: a packaging perspectiveOral presentation