Effect on thermal fatigue reliability of decreasing the pitch of PSGA packages from 0.8 to 0.3 mm

Vandevelde, BartBartVandeveldeBeyne, EricEricBeyneVan Puymbroeck, JanJanVan PuymbroeckHeerman, M.M.Heerman2021-10-142021-10-141999https://imec-publications.be/handle/20.500.12860/3967Effect on thermal fatigue reliability of decreasing the pitch of PSGA packages from 0.8 to 0.3 mmOral presentation