De Vos, JoeriJoeriDe VosPeng, LanLanPengVan Ongeval, JoostJoostVan OngevalPhommahaxay, AlainAlainPhommahaxayMiller, AndyAndyMillerBeyne, EricEricBeyneKurz, FlorianFlorianKurzWagenleiter, ThomasThomasWagenleiterWimplinger, MarkusMarkusWimplingerUhrmann, ThomasThomasUhrmann2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/28174Influence of wafer-to-wafer bond alignment on via-last patterning for 3DSOC applicationsMeeting abstract